Used DAGE 4000 #9359369 for sale

DAGE 4000 is an advanced, automated bonder designed for use in a variety of applications, including die bond, flip chip, and ball grid array bonding. This equipment provides excellent precision and consistency, ensuring high-quality bonds every time. 4000 consists of a base platform, a vision system, a controlled-pressure dispenser, and a bond head. The base platform is designed for maximum stability, helping to ensure accuracy and consistency during bonding. This unit also comes with an automated program interface (API) that allows users to access various functions quickly and easily. The vision machine is designed to accurately locate bonding sites and accurately align the bond head. This feature is particularly important for flip chip and ball grid array bonding, where accurate alignment is critical. This tool also includes a controlled-pressure dispenser that dispenses the bond material accurately, ensuring each bond has the right amount of material applied correctly. The bond head is designed to suit the application. For example, the auto-aligning bond head makes it easy to bond different flip chip orientations. This asset can also bond a variety of die sizes, ensuring the right bond is created every time. DAGE 4000 includes a range of features that improve performance and ensure high-quality bonds. For example, there is an auto-tune feature that ensures the bond head is tuned to the optimal settings for each job, as well as an auto-center feature that maintains the centered alignment of the bond head for consistent bond placement. In addition to its technical features, 4000 also offers enhanced convenience. It comes with a metrology kit to make sure the bond is properly placed, as well as an easy-to-use user interface. The model also comes with a suite of software tools to help users accurately program their bond jobs. Overall, DAGE 4000 offers excellent precision and consistency, making it a great option for high-volume, high-accuracy bonding applications.