Used DAGE 4000 #9366911 for sale

DAGE 4000 is an advanced die bonder machine manufactured by the UK-based DAGE Precision Industries. It offers precision die attachment, hermetic sealing and wire looping capabilities in a vacuum environment and is one of the most reliable die bonding machines on the market today. Its modular design allows it to easily accommodate a variety of components and substrates, making it ideal for many applications including post-die attach, laser cutting and grinding, and heating and cooling treatments. 4000 is capable of a wide range of process tasks from ultra-fine attachment to large-scale die attaching (up to 400mm2). It features an x/y stage with 0.5μm accuracy for precise die placement and ultra-precision bond looping. The automatic non-contact vision alignment system is designed to ensure very consistent, accurate bond looping and placement with minimal operator intervention. DAGE 4000 is ideal for packaging a wide range of semiconductor devices such as the advanced flip chips, multi-chip modules and Ball Grid Arrays (BGAs). It is specially designed for flip-chip die bonding and is capable of bonding up to 12,000 components per hour. The machine has an optional hermetic seal module which can be used to seal up to 60 devices per hour. In addition to its die-bonding capabilities, 4000 also has a range of additional features including nitrogen assistive reflow oven, automatic non-contact vision alignment, flexible process control (including temperature and pressure setting), digital camera inspection system, and a wide range of monitoring options. All of these features work together to provide a comprehensive solution for die attach and hermetic sealing needs. Overall, DAGE 4000 is an advanced and reliable die bonder machine which can provide an easy and efficient solution for die attachment and hermetic sealing needs. It offers the ability to accurately position a wide range of components and substrates, while its comprehensive set of features make it a great choice for a variety of semiconductor device packaging tasks.