Used DAGE 4000 #9378772 for sale

DAGE 4000 is an automated wire and die bonder, used in microelectronic assembly and testing. It combines many different components, including a high-speed vision equipment, an accurate die verification system, and a modular force and vacuum module, to provide a wide range of bonding capabilities. 4000 is capable of both ball bonding and wedge bonding, allowing for a variety of wire and die configurations. It provides precision gold wire bonding, with a bonding speed of up to 150 bonds per second, as well as an accurate wire alignment. DAGE 4000 is also capable of wire diameters from 10 to 200 microns, and a bond head travel range of up to 150 mm. Additionally, the unit includes a die verification machine that checks the accuracy of each bond location, ensuring a secure and reliable connection. The modular force and vacuum module within 4000 provides precise control of power and pressure for each bond, and the built-in user interface allows for easy adjustment of parameters. DAGE 4000 can also accommodate multiple bond heads, allowing for multiple-part assemblies on the same machine. 4000 is an advanced and technologically advanced tool, designed to automate processes for various microelectronic assemblies. Its combination of high-speed vision, die verification asset, and modular force and vacuum module, provide an efficient and reliable wire and die bonding model. DAGE 4000 is an ideal choice for companies looking to increase productivity in their microelectronic assembly and testing process.