Used DAGE 4000 #9379508 for sale

DAGE 4000
Manufacturer
DAGE
Model
4000
ID: 9379508
Bond tester.
DAGE 4000 is a state of the art bonder specifically designed for use in microelectronics assembly. It is a multi-function bonder capable of bonding microelectronic components as well as providing high accuracy die attach, underfill, and encapsulation services. Utilizing advanced air flow technology, 4000 is equipped with a patented air flow chamber allowing it to precisely control the soldering process. Built with a modular tooling system, DAGE 4000 is capable of integrating external tooling sets, enabling it to support multiple different bonding processes. Its intuitive interface and company floor connection options allow it to be tied into the rest of a production line for enhanced operational control and data monitoring. 4000 is designed to be used with a wide range of substrates, and can perform die attach, underfill, and encapsulation processes on PCBs, lead frames, CSPs, and other microelectronic components. With an optional sub-micron die alignment system, it allows for precise control over solder flow and temperature, creating bonds with high signal integrity. It can reliably bond components under a wide range of bonding pressures and temperatures, from 2 to 6lbs per square inch and 250°C to 400°C, respectively. DAGE 4000 is a reliable, versatile bonder, perfect for any microelectronics assembly process. With its air flow technology, modular tooling options, and intuitive interface, it provides superior performance while minimizing setup time. For added convenience, it can be upgraded with a spindle kit, enabling it to be used in a wide range of production environments. In order to ensure consistent performance, 4000 is also outfitted with advanced monitoring systems, including continuous thermal analysis and dynamic force mapping. It also features interchangeable nozzles and optimized process control, allowing for accurate real-time adjustment of the bonding process. All of these features make DAGE 4000 a top of the line bonder, perfectly suited for any microelectronics production line. With its advanced features and superior performance, it is sure to make any assembly process easier, faster, and more reliable.
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