Used DAGE 4000 #9390201 for sale

DAGE 4000 is a highly sophisticated, state-of-the-art bonder developed by the leading electronics test and assembly solutions manufacturer, DAGE Precision Industries. Originally designed for use in high-pressure bonding applications, 4000 has since become a must-have choice for precise and automated die selection and alignment, as well as heavy-duty bonding applications. DAGE 4000 bonder is designed to be easy to use and highly versatile, capable of accommodating many different types of metallic or plastic substrates. It uses a 4-stage die selection and alignment equipment, coupled with a heavy-duty bonder assembly for complex, intricate dies. 4000 has a fully automated, linear alignment system which allows the user to adjust its parameters in order to select the best substrate and bond sequence. This unit also reduces the need for manual intervention during the bonding process. DAGE 4000 utilises an advanced X-ray technology for real-time imaging of the dies, and the bonder also has a complete data package for quick and easy product selection and alignment. It provides particularly accurate results and has an impressive bonding accuracy of 0.003 inches. 4000 also features a pneumatically operated bonding stage which eliminates any need for manual force during the process, thus reducing the chances of damaging product yields. DAGE 4000 is also equipped with a range of built-in features and accessories for a full range of die bonding tasks. These include a bonded-die scanner, machine software, watchpoint logging, and an autocalibration tool. These useful features ensure consistent and high-quality results, while the built-in automated test programs and complete data package offer a convenient way to store and retrieve the most commonly used bond sequences and parameters. 4000 adds tremendous value to the industry with its superior quality and reliability. Its flexibility, ease-of-use, and superior bonding accuracy make this bonder ideal for many complex industrial applications requiring precise bonding and die selection.