Used DAGE 4000 #9392279 for sale

DAGE 4000 is a flexible and reliable bonder, ideal for use in die-bond, eutectic die-attach and flip chip applications. The bonder is equipped with advanced features that make it ideally suited for general microelectronics packaging applications. 4000 is designed with a user-friendly graphical interface and a full-function menu equipment, allowing easy access to all machine functions. The machine utilizes an integrated vision system with high magnification and resolution for precise die viewing. The needle alignment unit ensures optimal accuracy during die attach operations. In addition, the bonder features integrated bond head monitoring, allowing for continuous operation and process control. The high-precision motion control machine on DAGE 4000 offers a number of features that ensure accuracy and repeatability. A comprehensive and customizable bond profile editor allows users to customize their bond profile. The machine is equipped with temperature, force and current monitoring probes that provide real-time data for process optimization. The integrated measurement tool allows for accurate control of all aspects of the bond process. The bonder also features an advanced process control asset to facilitate rigorous process monitoring and automatic process adjustments. This model includes a PC-based control station, which provides a suite of tools for controlling, monitoring and optimizing the bonding process. This equipment enables fully automated process monitoring and adjustment to improve repeatability and accuracy. 4000 is designed for fast and easy setup, allowing users to quickly and easily adjust settings as needed for their application. The machine also includes several different automatic feeders for increased throughput and flexibility. The machines comes with a variety of advanced software options for monitoring and controlling the bond process. Additionally, a comprehensive service package is available to provide ongoing support and maintenance.