Used DAGE 4000 #9394474 for sale

Manufacturer
DAGE
Model
4000
ID: 9394474
Vintage: 2010
Bond tester 2010 vintage.
DAGE 4000 is a state-of-the-art bonder designed specifically to meet the rigorous requirements of the manufacture of semiconductor components. It is capable of producing high-quality and reliable bond results with a high level of accuracy and repeatability. 4000 offers a wide range of applications including ball bonding, wedge bonding, and laser die attach. The bonder is capable of producing bonds of lengths up to 750 mils (19 mm). It boasts a tight, repeatable tolerance of ±20µm in x-y positioning, which allows for consistent bond placement and minimizes the likelihood of rework during defect inspection. DAGE 4000 also provides high acceleration and velocity (2Gs and 300 mm/s, respectively) which ensures rapid motion and efficient performance. The bonder has an intuitive graphical user interface which enables users to easily and quickly program the most complex bonding operations. The interface also allows users to easily access data logging, graphical display, virtual simulation, diagnostic aids, and comprehensive recipe management. The bonder features wall-mounted control consoles which allow users to access equipment parameters quickly and conveniently. The bonder is powered by a high-performance 64-bit processor which allows the Bonding Chamber to respond quickly to dynamic changes in the production process. The internal electronic control system is designed to provide both flexibility and consistency throughout the bonding process. It ensures that the operator is able to quickly and accurately diagnose problems in each operation, enabling them to respond promptly and ensure optimal product quality. 4000 is extremely reliable and robust, offering low-maintenance operation to ensure maximum lifetime performance. It is designed to be as energy efficient as possible, thanks to its energy-saving control unit and intelligent algorithms that optimize cut times and monitor energy use. DAGE 4000 is the ultimate bonder for the manufacture of semiconductor components. Its precision engineering, intuitive user interface, and innovative control machine provide the highest performance and maximum efficiency, ensuring that the customer gets the highest quality product.
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