Used DAGE 4000 #9399543 for sale

DAGE 4000 is a high-end wire Bonding Equipment specifically designed for advanced research and development experimental testing. It is capable of automated open-loop and closed-loop bonding, as well as a variety of single-point or multi-point high precision ball, wedge and pull testing. This enables hand-free and fully automated operations at controllable bond speeds and force ranges or alternatively, manual operation with full instrumentation visibility. For the most accurate and reproducible bonding results, the system utilizes 5-axis robotic actuation, enhanced with shear force feedback and closed-loop FOCUS™ vision-guided bond formation technology. 4000 also offers absolute repeatability, making it one of the best systems on the market for scientific and laboratory wire bonding applications. The unit is capable of bonding randomly configured components as either singular parts or arrays in a wide variety of materials and shapes. It offers a plethora of ball bond capillary configurations and four precision controlled wedge bond components. The wire bonder also offers both programmable finger or parallel bond head configurations which are available in several adjustable sizes. DAGE 4000 provides unique process capabilities such as integrated CCD camera capability for observation and control of the device and bond head, as well as real-time measurement of bond parameters. The machine has options for both air and eutectic bonding, as well as fast process testing and automated ball bond pull testing. Additionally, it has integral process monitoring with digital image correlations and include features such as force-distance integration, XY profile correction, and process parameter monitor. The tool supports a variety of software options, designed to let the user adjust parameters, analyze bonded devices, and provide tight process controls. Furthermore, it allows the user to maintain precise process control and monitoring, even in challenging tests and applications. Overall, 4000 offers advanced control, precise accuracy, and maximum reliability for a variety of advanced research and development applications that require precise wire bonding and testing of electrical and mechanical components.