Used DAGE 4000P #9329159 for sale

DAGE 4000P is an advanced bonder designed for high-precision die attach bonding applications. The equipment offers a robust, fully automated bond head, capable of die attach, flip chip, and wirebonding processes. DAGE 4000 P includes a dedicated high-precision bond head with the latest technology for advanced bond profiles. The C-stage offers accurate motion control to enable the bonder's precision capability. The bond head provides precise repeatability and a wide range of vacuum and pressure levels for optimum control over the die attach process. The bonder also features a user-friendly software interface, enabling the user to set up the system easily. 4000P utilizes a powerful kinematic drive and a reliable and precise X/Y open loop, closed loop motion control unit. This allows for precise and repeatable bonding at every cycle for consistently high-quality results. The machine is further integrated with a 19" LCD screen for easily viewing and controlling the tool's operations. The intuitive software offers a rich library of features for bond testing and monitoring. The bonder is also equipped with an integrated vision asset and high-resolution optical imaging functionality for precise bond inspection and traceability. The model also provides an automated equipment health monitoring and diagnostic capability for troubleshooting and condition monitoring. Furthermore, the system is easily integrated into any manufacturing environment enabling quick and efficient setup and commissioning. Overall, 4000 P is a reliable, flexible, and precise bonder, ideal for die attach, flip chip, and wirebonding processes. It is particularly useful for high-precision bonding applications and provides the user with precision, repeatability, and reliability for consistent high-performance results.