Used DAGE 4800 Series #9289688 for sale

DAGE 4800 Series is a high-precision flip-chip ball bonding platform from EXFO. This advanced bonder is designed for a wide range of ball-bonding applications, such as lead-free solder-on-chip (SOC) flip-chip, gold-on-chip (GOC) flip-chip, ball-grid-array (BGA), and chip-on-board (COB) flip-chip. 4800 Series provides optimal performance for chip-leading applications, with specific capabilities that provide a superior level of precision. This includes its superior split central processing unit (CPU) architecture, which allows for maximum precision and on-the-fly changes during a bonding operation. It also features zero-minor-axis (ZMA), allowing for the fine positioning of features on devices as small as 0.3mm. Additionally, DAGE 4800 Series provides an intelligent bond recognition equipment (IBRS), which detects bond shifts with a resolution of 1 micron. 4800 Series is also designed for maximum flexibility. It is capable of bonding tapes including tapes for flip-chip components, CCGA, QFN and DFN components, and micro electro-mechanical systems (MEMS). It also supports bonding with standard 8.4mm or 12.7mm wire diameters. In addition, each machine can be optionally configured with up to four flip-chip head spindles, as well as a range of vision systems and flipping camera modules. Moreover, DAGE 4800 Series is highly reliable, with an automated micro-fusion detection capability that monitors each bond in real-time, providing superior quality control. It also features multi-point monitoring to increase productivity and double the throughput of a conventional bonding system, and is equipped with a sophisticated error-handling unit to help avoid common bonder errors. Finally, for additional efficiency, 4800 Series features a powerful, intuitive user interface with features that allow users to customize the machine display, reduce downtimes, and secure the machine and data. It is also compatible with PC-based GSD and NC language programs, and a range of special features is available such as customized feeders, sample loaders, and flip-chip handler integration. For users who require an advanced, reliable, and flexible bonder for flip-chip applications, DAGE 4800 Series is an ideal solution.