Used DAGE 4800 #9301179 for sale

DAGE 4800 is a wire bonder designed for the production of high-density packages and circuit boards. It is used in the microelectronics industry for applications such as bonding flat ribbon cable to circuit boards, flip-chip bonding, hermetic sealing, and thermal seal bond. 4800 offers a range of advanced features that make it ideal for precision applications. DAGE 4800 provides fully automated set-up for easy programming and fast turnaround, ensuring consistency of wire bonding parameters. It offers dual-plane wire welding with full panoramic view of the entire bonding operation and real time 3D positional imaging, allowing for finely controlled wire pulling speeds and consistent mold height. This system also features advanced vision and control systems that provide high accuracy, quick set up, and full process control monitoring. 4800 also includes temperature control, creating an optimal environment for wire bonding processes. DAGE 4800 comes with multiple bond head options that are compatible with a wide range of packages, substrate materials, and wire diameters. It also includes a die positioning system that enables precise and repeatable die placement, as well as an embedded video link that allows remote monitoring of the operates. In addition, 4800 is equipped with a laser die attach option, which enables fast cycle times for bonding in a fraction of the time compared to traditional thermal die attach systems. This bonder also features an integrated wafer scriber and die leveler for glass printed circuit boards, as well as anti-corrosion protection to help reduce damage to sensitive components. DAGE 4800 is a versatile and reliable bonder that is easy to use and highly accurate, making it perfect for precision and high-density wiring in electronics manufacturing. Its advanced features make it the ideal choice for producing fine and consistent wire bonds, and its temperature control system ensures a more accurate and reliable bonding process.