Used DAGE 5000 #9105997 for sale

DAGE 5000 is a high-performance automated wafer bump bonding equipment complete with high-precision up and down thermal compression. It is designed to meet the needs of modern semiconductor manufacturers for reliable, high speed, high-quality bond formation. The system features a powerful, full 5-axis motion control architecture with intelligent, up and down thermal compression, enabling a single bonder to be used across a wide range of wafer sizes and bonding applications. The unit boasts capable, accurate bonding capabilities and is capable of achieving the highest bond yields due to the advanced control machine and thermomechanical bond head. This provides the highest level of bond quality and repeatability. The tool components are designed, developed, assembled, tested and certified in the UK for the highest quality performance. The power of 5000 allows it to handle semiconductor substrates from 15.4mm up to 200mm in size. With up to three independently controlled power plans and a maximum of eleven bond heads, DAGE 5000 is able to handle a wide range of substrates and products with very accurately controlled temperature, compression and speed settings. 5000 also allows for sophisticated monitoring and control of the process parameters, with data gathering capabilities for real-time yield monitoring and data logging for statistical process control. DAGE 5000 also features a custom designed bond head, featuring advanced opto-mechanical design, providing an unprecedented level of control over thermomechanical parameters and temperature profiles. This ensures that the highest levels of repeatability and accuracy are achieved, providing reliable bond quality. Finally, the asset is also well suited for ease of maintenance and servicing, with all maintenance points easily accessible from the operator's side for easy maintenance and cleaning. In addition, automatic setup, calibration and maintenance procedures are included for quick and easy setup and maintenance, reducing downtime.