Used DAGE 5000 #9195907 for sale

DAGE 5000 is a state-of-the-art desktop bonder ideal for applications requiring high accuracy and reliability. It is suitable for assembly, die attach and flip chip processes. This bonder features a uniquely intuitive user interface to provide a more efficient process. It is equipped with an intelligent autofocus system that allows for precise alignment of components. A DualScan™ laser plus ultra-microscope image recognition system creates a highly accurate die location accuracy of ±3µm at 3 Sigma, defeating conventional alignment methodologies. This bonder supports a wide range of force and temperature setting resolutions at up to 8 uniform linear force-thermal-time profiles, with force settings as low as 0.01N. Its built-in conveyor stores up to 40 E-wafer cassettes, providing flexibility for high-volume production requirements. 5000 is designed to provide high-speed production rates of up to 1200 placements per hour, combining its high accuracy with its fast performance. Its user friendly software allows easy program setup and recall of production jobs, ensuring quick and efficient automation of processes. Its optional software package for 3-D program generation automatically creates placement programs with accurate 3-D geometry, eliminating costly manual program entry. This bonder also features 28 air and vacuum nozzles options in order to fit different user needs. Additionally, the nozzle selection can be updated quickly and easily to accommodate for changes in component type and production needs. Robust construction and careful attention to every detail means that DAGE 5000 offers reliable, consistently high-performance over long periods. Its advanced feedback control system senses process conditions and actively prevents conditions that could lead to a bond defect. Overall, 5000 is a reliable, versatile, and quick bonder that promises to bring exceptional levels of accuracy and efficiency with each use. The perfect combination of automated force-thermal-time control and ergonomic design make it the perfect choice for any assembly and die attach bonding processes.