Used DAGE 5000 #9277845 for sale

DAGE 5000 bonder is a powerful, automated bonding tool ideal for use in the electronics and semiconductor industries. This innovative machine is a fully automated, high-speed point-to-point gold bonder with an impressive four-inch travel distance. 5000 bonder also has adjustable tooling and programming for different sizes of components and a digital display allowing for increased accuracy when positioning the bonder. This system also allows the user to pre-program the bond point pattern, but also has the capability to be changed and/or customized as needed. Additionally, DAGE 5000 bonder has a scanning system which allows precise control over pad sizes and surface profiles. This ensures that the bond process is performed in a uniform and consistent manner. The machine can also handle multiple pitches, including 80/20 pitch and the much-smaller 40/20 pitch. In addition to automation, 5000 bonder offers superior speed and repeatability when bonding. Its high-precision automatic feeder ensures a constant, stable rate, allowing it to reach speeds of up to 1,000 bonds per hour. This allows for improved overall throughput and increased production. DAGE 5000 bonder also offers superior reliability. The integrated temperature control of the machine's print-and-fire cycle ensures consistent results. In addition, the machine features a low-mass, low-distortion design to ensure components that are held firmly in place. This means that the bond point will not shift or become damaged during production. 5000 bonder is also designed with safety in mind, featuring safety interlocks and automated shutoff systems in the event of an emergency. The machine also comes with an automatic calibration system to ensure the accuracy of the machine's operations before each use. Overall, DAGE 5000 bonder is a reliable and powerful solution for the electronics and semiconductor industry. Its high-precision design, automated features, and reliable components make it an ideal bonder for any assembly process.