Used DAGE 5000 #9384561 for sale

DAGE 5000 is a Microfiltration (MF) bonder designed for wafer bond preparation, die attach, and die attach clean-up. It is a semi-automated equipment that provides precise and uniform placement of material onto wafers and die. 5000 is easy to use with advanced features and capabilities that allow for a wide range of applications. The system consists of a dual head bonder, an x-ray imaging unit, an optical microscope, and a vacuum chuck. The dual head bonder has two independently-controlled cameras, giving it an unmatched level of precision and control. The x-ray imaging unit allows for detailed inspection of materials on and around the bond point. This allows for identification of microscopic defects that may not be visible under an optical microscope. The optical microscope provides detailed resolution of the bond point for inspection. The vacuum chuck provides excellent adhesion between the wafer and die, ensuring a tight bond. DAGE 5000 is equipped with an advanced die motion unit that is capable of rapid cycle times and repeatable die uniformity for production applications. The machine is supported by a full complement of accessories, including a wide range of thermocouples, recommended fixtures and tools, and a range of adhesive materials. 5000 is compatible with most die attach chemistries and can operate in both static and dynamic modes. Finally, DAGE 5000 has comprehensive operational software and provides detailed data from each bond spot, allowing for precise control and tracking of the bond process. The tool also provides extensive tooling, process recipe data, and a variety of image analysis options. 5000 is an excellent choice for precision die attach and wafer bonding applications. With its advanced features and capabilities, it provides reliable and uniform bonds with minimal production costs.