Used DAGE 5000P #9099239 for sale

DAGE 5000P is a high-precision, precision micro-mechanical bonder designed for use in a variety of industries, including microelectronics, optoelectronics, telecommunications, aerospace, and other demanding applications. The equipment offers superior bond strength and alignment accuracy with a temperature range of between 8 degrees Celsius and 250 degrees Celsius. The bonder is capable of producing tight and strong metal-to-metal bonds, as well as hybrid connections. The device is equipped with a high-resolution interactive graphical user interface, which allows for precise adjustments of the bonding parameters. It consists of several modules, including a power and control unit, a vision system, a motion controller, and a bonding head. Several additional modules are available, such as an integrated heater module to improve the temperature stability, and a vision unit module to monitor the process. 5000P has an automated temperature and force control that enables it to be used in a variety of settings. It is capable of producing non-contact and ultrasonic bonds, and features an integrated temperature control mechanism for setting the correct temperature of the material before the bonding process. Additionally, the machine also has an adjustable voltage of between 70 and 1000 volts. The device has several safety features, such as a temperature-sensing probe, a pressure sensing board, a gas release valve, and a cool mode. The tool also has multiple bond and profile cycling controls, as well as an automatic release mode. An onboard monitor allows operators to observe and fine-tune the process in real-time. The device is capable of bonding in high-vacuum environments, and is able to work with specific types of semiconductor components, such as leadless chip carriers and connector pins. Furthermore, the bonder has a modular design that can be customized to the requirements of the customer for specialized applications. In summary, DAGE 5000P is a highly efficient and reliable bonder that is suitable for a wide range of microelectronic bonding applications. It features a powerful yet intuitive user interface, a wide range of temperature and force control capabilities, and multiple safety features. The modular design makes it possible to customize the device to specific requirements of customers, allowing for more versatility and flexibility.