Used DAGE 5000P #9183130 for sale

DAGE 5000P is an advanced dedicated electrical wedge bonder designed to provide the highest level of accuracy and precision for electronics manufacturers. It is an automated equipment that uses computer-controlled servo motors to guide wire bonding tools for a range of applications. It provides high resolution images for inspection and a larger overall system footprint than other competitive models. 5000P features a range of innovative technology for the most demanding applications. Its high-precision, closed-loop motion control and advanced force sensing technology provide outstanding stability and repeatability for both solid and straddle bond applications. DAGE 5000P also features a 250 MHz sampling rate of a 0.28 µm per axis resolution designed for highly accurate and repeatable placement of wire bonds with consistent loop height, tension, and plating quality. 5000P's integrated advanced non-contact vision unit is specifically customized for the electronics industry. It is equipped with a powerful image capture board, an integrated LED lighting machine, and vibration dampening technology to ensure accurate trace recognition and alignment. Its high resolution scratch off microscope allows for the highest quality inspection of very small areas. DAGE 5000P includes numerous hardware and software tools to ensure high performance accuracy. It features an Operator Function Wizard for faster set up and and improved quality control, programmable motion profiles to ensure precise repeatability, and optional software tools for unique testing such as x-y linearity tests and wire tracking. Additionally, its intuitive automated user interface allows multiple users to share programs and enables remote diagnostics for quicker turnaround times. 5000P sets a new standard for bonders designed specifically for the electronics industry. Its high-precision motion control, advanced force sensing technology, and integrated non-contact vision tool make it an ideal solution for shorter production cycles, improved yield rate, and higher quality bonds.