Used DAGE BS250 #139181 for sale

DAGE BS250 is a state-of-the-art computer-controlled bonder ideal for a wide variety of automated micron-level ball and wedge bonding applications. It features an 11" x 11" XY-axis stage with a 11" z-axis head, allowing for precise and accurate micron-level bonding. The equipment is run by a high-resolution camera, which allows it to identify and distinguish between different types of bonds, as well as micro-components. The system is capable of bonding with a maximum speed of 1100 microsecond for a bonder up to 4 mil. BS250 is capable of automated ball, wedge and scroll bonding. The automated ball and wedge bonding capabilities allow for reliable and repeatable processes with quick turnaround and minimal operator involvement. Additionally, the unit's Ball Bond Heater Control allows users to tailor their temperature profile to the specific application being performed. The wedge bond automation feature features a high throughput of up to 45 bonds per minute and a wedge Bondhead travel range of 30 mm. DAGE BS250 is fitted with a thermal imaging head, which is capable of understanding a wide range of wire diameters, ranging from 0.1 to 2.5 mm. The thermal imaging head also features a automated de-bonder and integrated viewing scope, allowing users to check bond quality and verify critical bonds. The integrated viewing scope is also equipped with Z-axis movement, allowing for easy viewing and centering of the bonder head for enhanced operation. BS250 is a robust and reliable machine, complete with a variety of tools and features that enable users to consistently achieve micron-level bond requirements. In addition to the automated ball, wedge and scroll bonding capabilities, the tool also provides an integrated heated epoxy and fine wire tie asset that significantly improves cycle time and accuracy. The model is also modular and upgradeable, allowing for customizable configurations, as well as extended product life. Furthermore, its manual operation capabilities facilitate remote programming and manual override of bond parameters to increase flexibility. DAGE BS250 is an ideal bonder for applications requiring high accuracy, reliability and speed.