Used DAGE BT-100 #293645145 for sale

DAGE BT-100 is a bonder designed for micro-joining components and providing high strength, repeatable joints. It is specifically designed to work with both die attach and wire bonding applications, while still providing users with control over their processes. DAGE BT100 is powered by an integrated controller with a high resolution graphical display and a powerful embedded processor. This allows for precise control over both the die attach and the wire bonding processes. The controller also provides real-time monitoring of process parameters, ensuring that optimal performance is achieved. In addition, the controller supports a variety of optional features, such as password protected access, message management and programmable functions. BT-100 is equipped with an advanced precision die attach head and a high resolution, force-controlled wire bonding head. These are designed to provide the highest accuracy and repeatability of bond placement. The force-controlled wire bonding head also reduces solder joint or fatigue failures, working to preserve the integrity of the bond. BT100 features intuitive touch screen operation and includes a variety of helpful tools for easy setup and operation, like automated parameter selection and job storage. The bonder is compact and easily integrated into production environments, regardless of size or available space. Furthermore, the all-digital design of DAGE BT-100 facilitates software upgrades as well as quick repairs when necessary. Additionally, DAGE BT100 meets international safety standards and runs on 120/240VAC, making it a reliable and safe option for production processes. The bonder is also protected by an IP43 rated enclosure and a retractable skirt providing safety and convenience, as well as preventing particles from entering the interior of the bonder. Overall, BT-100 is a reliable, high-performance micro joining platform, offering precision, repeatability, and safety for micro-joining components.