Used DAGE BT-14 #12586 for sale

DAGE BT-14 is an intelligent, cost effective, high-precision ball bonder suited for applications where precision bonding is essential. It has an innovative design, which allows it to bond up to 200mm of wire with top repeatability accuracy, high throughput rate, low failure rates and easy to use operation. The equipment is capable of various different bonding techniques, such as resistive and thermo-compression. This versatile machine offers a user-friendly interface and a robust design for reliable and consistent performance. The user-friendly environment includes interface customization, system diagnostics, and easy access to stored program sequences. It features a 500GB hard drive, Windows-compatible PC, and an intuitive touchscreen display. The unit is configurable to specific applications and process requirements, with the ability to configure bond parameters, selectable bond heads, wire grasping configurations, and more. The use of advanced technologies such as programmable z-axis, low noise ultrasonic drive, and dual-axis vision systems further elevates BT-14's performance. The dual-axis vision machine provides accurate ball placement and bond integrity testing to reduce scrap. The low noise ultrasonic drive helps to minimize ball bonding time. The programmable z-axis permits for varying wire lengths and bond angles. This bonder meets extremely high quality proposals and is suited for a variety of industries, from semiconductor to LED. The tool runs in a cleanroom environment, so that the environment is free from air turbulence and dust particles. The gas control unit of the asset is equipped with an automatic flush model and an integrated environment monitoring equipment to ensure its cleanroom compliance. The security of the system is enhanced with a unique two-tier password unit that is customizable by the user. It is certified to comply with the industry standard ISO 9001. Overall, DAGE BT-14 is an intuitive and customizable bonder that can perform a variety of bond processes quickly and accurately, which makes it the perfect solution for today's demanding precision bonding requirements.