Used DAGE BT-20 #9092426 for sale

DAGE BT-20 is a fully-automated and highly productive CCD-driven ball bonder, designed and manufactured by DAGE - a world leader in producing precision x-ray and assembly systems. It offers the latest in technology and features for wire bonding applications, including flip chips and other devices with extremely fine pitch or bonds which require very precise positioning accuracy. BT-20 features a versatile "Z" stage design for increased access and better part loading that enables it to bond parts up to 20mm in height. Its high accuracy piezo stages guarantee precise wire positioning, while its advanced electronics allow the operator to choose from multiple bonding parameters such as high speed, low force, or even self-programmed wire pattern settings. Additionally, the bonder is equipped with advanced vision systems that allow multiple image capture down to 0.6um resolution, as well as doubling the maximum wire loop heights for finer pitch sizes. For operator convenience, DAGE BT-20 comes with a touch screen panel that enables easy part set-up and efficient parameter selection using icons and intuitive menus. It also features a convenient and secure part carrier system which allows easy part loading and retrieval, with adjustable settings for various sizes and package types. Moreover, the advanced bonder can be integrated with other DAGE and third party equipment for automated part loading and testing, making it ideal for both mass production and prototype runs. With its robust and dependable design, BT-20 has been tested and proven to provide industry-leading yields and superior bond integrity for thousands of bonds per hour. Its robust construction also offers excellent repeatability and longevity, making it an ideal solution for demanding, high-volume wire bonding applications. The bonder also comes with a variety of options and accessories, enabling users to customize the system according to their requirements. Overall, DAGE BT-20 is a well-engineered and dependable automated ball bonder that sets a new benchmark for performance, accuracy and productivity in wire bonding applications. It is the perfect choice for users looking for a reliable, economical and efficient solution for their addition and flip chip production challenge.