Used DAGE BT 23 #9009348 for sale

DAGE BT 23 Bonder is a specialized bonder used for a range of electron and ultrasonic bonding applications. This high-precision system is suitable for a variety of bonding processes such as wire bonding, thermocompression bonding, bonding between metals and plastics and connections between components on a PCB. BT 23 Bonders come with a choice of bond heads including thermocompression, microweld, wedge and pull style heads, each capable of supporting a variety of bond sizes and materials. The bonder also features excellent motion control, allowing access to tight bonding locations, multi-axis access and power output control for each bond head. The flexibility of this system also allows for multiple bond sequences for various applications. The machine's user friendly graphical user interface allows for easy programming, data logging and diagnostics, making DAGE BT 23 Bonders an attractive choice for production lines. With it's integrated superimposed scanning technology it accurately identifies bond points saving time and reducing errors. The data-logging feature also helps to improve test and manufacturing yields. The machine is equipped with a thermal imager suited for temperature monitoring and non-contact testing during production, as well as a touch probe for finer work such as surface profiling. The touch probe combination with advanced motion control makes it perfect for high precision applications. The Bonders are equipped with a powerful computerized oscilloscope, which combined with a variety of measurement probes can be used to accurately measure various process parameters, making them ideal for process control and troubleshooting. They can measure bond height, resistance measurements, scan time and other parameters with great precision and accuracy. Overall BT 23 Bonders offer the perfect balance between flexibility, precision and control, making them suitable for a wide range of bonding applications across various industries.