Used DAGE BT 24 #293710045 for sale

DAGE BT-24 is a state-of-the-art automated flip chip bonder designed to improve the process of processing flip chip components. This advanced equipment is capable of performing a variety of advanced functions that ensure uniform and efficient flip chip interconnection. Its user-friendly features and advanced technology make BT-24 an ideal bonding solution for any size production line. DAGE BT-24 utilizes a unique thermal imaging system that produces a high-resolution image of each flip chip component to ensure accurate bonding of the soldered bumps in place. This unit actively monitors and adjusts the temperature as needed during the entire bonding process. The machine also maintains a high degree of accuracy when it comes to the alignment of the soldered bumps. This ensures that the bumping and bonding process is always done correctly. BT-24 also features a powerful vision-infraed alignment tool that uses lasers to accurately align the components before and during the bonding process. This is done in order to get the exact orientation of the components during the entire process. This eliminates the need for manual alignment, which can be time-consuming and costly. In addition, DAGE BT-24 can be used to bond components on substrates up to 0.6 millimeter in height and a temperature range of up to 160°C. This ensures that the asset works well on a variety of substrates and is able to bond components even in difficult applications. BT-24 also features an intelligent machine interface model that makes it easy to operate the equipment and allows for quick setup and operation. This equipment provides users with access to real-time status information and alerts, along with detailed control of machine parameters. This enables users to quickly make adjustments and optimize their use of the bonding system. DAGE BT-24 is designed for use in professional applications and comes with advanced features that make it an excellent choice for any organization looking for reliable and efficient flip chip bonding performance. It utilizes its thermal imaging unit, laser alignment technology, and machine interface machine to consistently deliver reliable and accurate flip chip interconnection results.