Used DAGE BT-4000 TPXY #293616261 for sale

DAGE BT-4000 TPXY is a high-performance automated ball bonder with advanced micro-tweezer technology. It is designed for a wide range of applications including the mass production of ICs, hybrid ICs, and semiconductor packages. The bonder is capable of handling a variety of PCBs, substrates, and leadframes, making it ideal for a wide range of products. The bonder can support up to 4000 bonds per hour, enabling greater productivity and cost savings. The ball bonding tool uses micro-tweezers to ensure precise control and high accuracy. The tweezer force is optimized and adjusted based on the bond shape, material surface roughness, and wire tension. As a result, the tweezer force allows for better quality bonding and improved bond speed. BT-4000 TPXY features a self-tensioned, optically guided wire clamp that ensures accurate bonding and correct wire placement. The ball bonder also comes equipped with a 4-Axis high-speed motion equipment that enables precise wire positioning and ball manipulation. The system incorporates ultra-precise actuator and drive systems for smooth operation and reliable performance. DAGE BT-4000 TPXY is designed to operate in a wide range of conditions, from cryogenic temperatures to high temperatures up to 100°C. It has a built-in vision unit that can be used to monitor the bonding process during production. The vision machine can detect and analyze the quality of wire and ball bonds, making it an ideal tool for failure analysis. The vision tool can also be used to detect off-specification bonds. BT-4000 TPXY comes with a comprehensive set of accessories including separate manual and automated modes to simplify setup and integration. The bonder includes a variety of settings that can be used to customize the settings according to different bonding needs. Other features include intuitive user interface, gold wire/loop control, multiple PCB alignment systems, an auto-bonding sequence, and a ball-bonding machine listener. Overall, DAGE BT-4000 TPXY is a highly reliable and efficient ball bonder that can handle a wide range of materials and applications. Its precise control, rapid automation, and enhanced vision capabilities make it an ideal choice for modern production environments. This cost-effective bonder is an invaluable asset for the production of a wide range of products.