Used DAGE BT-4000 TPXY #9228329 for sale

DAGE BT-4000 TPXY is a fully-automated ball bonder designed for use in a reliable and efficient microelectronics assembly process. This tool is capable of performing ball bonding, wedge bonding, and ribbon bonding on a variety of materials including aluminum, gold, copper, and silver. BT-4000 TPXY also features an adjustable magnification system for improved performance and greater control over bonding parameters. Ball bonding is a complex process and requires precise control over bond parameters. DAGE BT-4000 TPXY is capable of performing ball bonding operations quickly and accurately, with an integrated force monitor and adjustable programmable parameters. This allows for precisely controlled adherence to standard bond strength requirements. In addition, unique "soft-stop" and "soft- start" settings offer superior control over bonding parameters and process variables. The wedge bonding process provided by BT-4000 TPXY is incredibly reliably, efficient and fully automated. The process has a total bonding cycle time of only 0.6 seconds, while the maximum wire loop size is 10mm and the maximum wire feed distance is 15mm. Additionally, the tool can handle and lay down wires from 0.025 inches in diameter, up to 0.6 inches. The ribbon bonding feature offers precise control over the wedge bond sequence and tightened capture of the ribbon. DAGE BT-4000 TPXY encompasses a variety of features, such as automatic alignment, adjustable magnification system, high resolution optics, swivel lighitng to improve alignment and visibility of the capillary/stylus, and a full range of electrical parameters with an integrated monitor. BT-4000 TPXY also features user-friendly software, intuitive error detection and correction, and a climate controlled workstation for improved reliability. The tool is particularly adept at fine-pitch bonding and termination achievable with high accuracy and low deposition forces for both small- and large-scale microelectronics assembly processes. Ultimately, DAGE BT-4000 TPXY is an extremely capable and dependable automated ball bonder suitable for a wide range of microelectronics assembly processes. Its fully automated features and impressive capabilities make it an ideal choice for a reliable and efficient assembly process.