Used DAGE BT23-PC #9083699 for sale

DAGE BT23-PC is a state-of-the-art wedge bonder designed to deliver a high quality and precise bonding performance for a variety of applications. This advanced equipment provides fine bond control and accuracy in a wide range of bonding environments. BT23-PC system features an advanced high resolution CCD camera for precise alignment of substrates and ultra-fine pitch bonding for demanding bonding requirements. This allows for the production of complex interconnects that may be required for a variety of applications including smartphones and other mobile devices. DAGE BT23-PC is equipped with a powerful bond head that applies high quality bonds with accurate repeatability and speed. It also offers oscillating and paddle wire optimization for improved performance and accuracy. For additional flexibility, the unit offers a variety of bonding wires, which include gold, silver, copper, and aluminum, as well as bonded-on ribbon cable. BT23-PC is capable of managing a variety of bond parameters including bond force, temperature, and current. This allows for the selection of optimal bond parameters for any given substrate or process, ensuring a consistent high-quality result. To complement the powerful bond head, DAGE BT23-PC comes equipped with a high-speed autocollimator that is capable of precise mid-bond and post-bond location adjustments for precise alignment of the bond head with the selected bond pad. BT23-PC is also designed for easy user-friendly operation. It offers an intuitive user interface, with graphical programming for easy set up and changeover. The machine also includes a variety of data tracing functions such as bond pressure, temperature, and current, to enable precise control and adjustment. In conclusion, DAGE BT23-PC provides precise bonding performance for a variety of applications. This advanced tool features a powerful bond head, adjustable bond parameters, and an autocollimator for fine bonding processes. The intuitive user-friendly interface and data tracing functions enable easy set up and changeover. BT23-PC is ideal for the demanding bonding requirements of smartphones and other mobile devices.