Used DAGE MCT 15 #159030 for sale

DAGE MCT 15 is a surface mountable gold bonder that is thermally and mechanically robust, designed for a variety of applications in the electronics industry. The bonder is specifically designed for gold wedge bonding, a specialized process used in semiconductor manufacturing and packaging where wire bonds are formed between contact pads on a device and external contact points on an ASIC or assembly. MCT 15 features a high accuracy, repeatable x-y motion system that allows for quick and accurate placement of bonding wires without operator intervention. The high precision motion control also helps extend the lifespan of the bonder and can accommodate a wide variety of wires and materials on an array of substrates. In addition to its robust motion control, a range of other features make DAGE MCT 15 a powerful tool for surface mount bonding. The controller is equipped with a thermal ignition source that allows for faster process times and repeatable results, while a rapidly achievable high magnification level gives operators unparalleled control over their bonds. Die height capabilities ranging from 0.5 - 10 mm ensure that MCT 15 can be used in a variety of different applications. DAGE MCT 15 also has several safety features built in such as an integrated emergency-stop button and an automatic flame-out system, ensuring a safe workplace environment. Furthermore, user-programmable parameters and a user friendly 17-inch LCD touchscreen make the programming of the bonder fast and easy, allowing for quick setup times and efficient operations. In summary, MCT 15 is a powerful, easy-to-use gold bonder designed for robust performance in the electronics industry. Its high accuracy, repeatable motion control, integrated safety features, and user friendly programming system make it an ideal choice for surface mount bonding applications.