Used DAGE MCT 15 #159049 for sale

DAGE MCT 15 is a fully automated bonder designed for multi-application bonding and testing in a production environment. The machine incorporates a triple monitor system allowing a visualized overview of the entire process control, test and inspection of the bonding process. MCT 15 has a flexible process design for optimising the overall production line for single and multi-cell packaging. DAGE MCT 15 has a 15" flat panel display which provides the operator with real-time graphical process control which is integrated with 3D vision systems for monitoring the performance of the bond process. The machine can accommodate a wide range of bond moulds for multiple applications. It has a low-profile design which allows it to be used in smaller areas making it space-efficient. The bonder is equipped with an industrial-grade, flexible bond head and a pressure release system designed to ensure a consistent and efficient bond depth. MCT 15 has a high-specification work station which uses a 25mm x 25mm travel axis. It also has an optimal programmable force line control feature which can be easily adjusted to meet varying production requirements. Additionally, it is also capable of dual-sided bonding and has an automatic calibration feature for simple, accurate program parameter adjustments. DAGE MCT 15 also incorporates an automatic fluxing system designed to provide optimal coating of substrates and to improve adhesion. It is capable of both temper heating and two-stage cooling each programmable to ensure reliable and consistent bonding. Additionally, the thermal profile of the bond is easily adjustable, making it ideal for numerous different electronic applications. Overall, MCT 15 is a reliable, economical, and user-friendly tool for multi-application bonding and testing. Its advanced features and robust design provide stability and versatility in an automated production environment. Its complete process control and automated calibration make it highly suitable for a range of electronic device manufacturing and packaging applications.