Used DAGE MCT 20 #82848 for sale

A DAGE MCT 20 bonder is a state-of-the-art microelectronics device designed and built to provide precise and reliable wire bonding. This device is commonly used in the manufacture of semiconductor products and microelectronic components. Its key advantage is its ability to produce connections of a high standard in a single operation, thus saving time and money. The bonder consists of three parts: the wire bonder, the anvil, and the clamp. The bonder, made of aluminum and nickle-alloy iron base, is the frame around which the parts are attached. The anvil is the part that provides the firm surface upon which the bond is formed. The clamp is used to secure the wire in place during the bonding process. The operation of MCT 20 begins with the loading of the wire into the bonder's wire guide. This is accomplished by securing the wire to the anvil and then carefully feeding it through the wire clamp. Once in place, the clamp is tightened to ensure a secure connection. The powerful motor of the bonder begins the process of heating and forging the wire, while the operator manipulates the wire with precision via the controls. Once the wire has been connected and heated, it is then sealed and the current is released. Various overlapping potentials are applied to the wire to ensure a strong and reliable connection. Finally, the bonder's temperature is increased to ensure a strong and durable bond, and the process is complete. The difference between DAGE MCT 20 and traditional wire bonders is substantial. With the aid of this device, manufacturers can not only accurately bond wires in one operation but also save time and energy in the process. Furthermore, the device is highly modular and customizable, allowing for significant improvements in the speed and efficiency of the wire bonding process. In conclusion, MCT 20 is a reliable and state-of-the-art microelectronics bonder that has revolutionized the way in which manufacturers can bond wires with precision and reliability. Its advanced features and user-friendly interface make it an excellent choice for those seeking a cost-effective, efficient and precise way of bonding wires.