Used DAGE MF-22A #65159 for sale

DAGE MF-22A is a high performance ball and wedge bonder that is used in the microelectronics industry for the interconnection of chip scale packages (CSPs), semiconductor components, and other circuit boards. It is equipped with an advanced imaging equipment and a user-friendly software interface, providing convenience and reliability for precision bonding. MF-22A features an Advanced Digital Image Recognition System (ADIRS) that uses digital imaging and optics to accurately and automatically recognize the size and shape of any bond target. With its intuitive, easy-to-use graphical user interface, DAGE MF-22A allows users to rapidly perform bonding operations to high accuracy. MF-22A has four programmable bond stations and an integrated output for package descriptions and bond data, which can be accessed remotely. The machine's high precision capability allows for ultra-miniature wire bonds and CSPs with extremely small apertures. The large viewing area also provides operators with an unobstructed view of their work, and allows them to quickly inspect joints, wire bonds, and other connections. Furthermore, DAGE MF-22A has programmable ball and wedge bonds, as well as a specially designed attach head, which locks into the chosen bond mode while making ultra-small wire bonds. MF-22A also has a scan rate of 12 kHz, providing users with precise and accurate fine pitch bonding. It is also equipped with a chip alignment unit that allows for precise placement and capture of the bond pad target area. Its quick, reliable speed increases production throughput, making it ideal for manufacturing processes with high bond counts. Additionally, the machine has a range of settings for enabling different tooling packages, as well as a broad range of tooling functions for building complete bond assemblies. This means that it is suitable for numerous applications, from micro-scale 3D bonding to large-scale mass production assembly. In conclusion, DAGE MF-22A is equipped with a number of advanced features that make it an ideal choice for the microelectronics industry. The sophisticated digital imaging technology, programmable bond stations, and integrated output for package descriptions and bond data make it an efficient tool for precision bonding. Furthermore, the fast scan rate, chip alignment machine and numerous settings allow users to quickly and accurately perform a wide variety of bonding operations.