Used DAGE MF-22A #9242846 for sale

DAGE MF-22A is a precision bonder designed for a range of advanced semiconductor applications. This bonder is highly reliable and offers superior performance in die bonding, wirebonding and microelectronic assembly processes. It is ideal for use in MEMS, optical, flexible and rigid circuit boards, and other microelectronics-related tasks. MF-22A features a patented sealing equipment that ensures excellent bond integrity and reliability while minimizing any potential leakage. It also features a fully automated process that significantly improves process accuracy, speed, and repeatability. With its high speed and repeatable performance, DAGE MF-22A is capable of achieving superb process yields. MF-22A has incorporated an array of advanced features, which include; a fully integrated, high-precision and large area die attach stage, a high speed wire bonding system with adjustable speed and current, an auto-oriented X,Y stage for handling large-area chips and devices, a rotary post bonding option for added flexibility, and an automated nozzle cleaning option with waterjet cleaning station. In addition, DAGE MF-22A is fitted with an ergonomic and user-friendly operating unit, making it easy to configure and operate. It is built with a modular construction, allowing for cost-effective installation and maintenance. The integrated safety features ensure reliable protection for both the operator and the machinery. Finally, its built-in monitoring machine ensures that users are constantly up-to-date with the status of their equipment. This way, any snags or errors can be identified and rectified in a timely manner, ensuring continuous performance and stable production.