Used DAGE MICROTESTER 22 #9269832 for sale

DAGE MICROTESTER 22 Bonder is a precision wire bonding instrument designed for use in high reliability applications such as the production of semiconductor components. The Bonder is capable of both ultrasonic bonding and thermosonic bonding techniques, enabling users to select which type is most suitable for each task. The Bonder is equipped with a number of advanced features designed to maximise accuracy and productivity. Firstly, it features a high-resolution, non-contact vision system, which allows for the precise placement of the wire bonds with a resolution of 22 microns. This is coupled with a stepping motor driven X-Y-Z alignment stage that ensures accurate and repeatable bond placement. Furthermore, MICROTESTER 22 Bonder can also interface with a range of wirefeeders and advanced wetting algorithms for more delicate and repeatable wire runs. In addition to its high positioning accuracy, DAGE MICROTESTER 22 Bonder is equipped with a range of automatic and manual bonding functions. These include a programmable ultrasonic generator, a programmable thermosonic generator, an adjustable parametric range, and a patented bond quality monitoring feature which ensures consistent bond integrity. The Bonder is also convenient to use. It is designed to be fully integrated into the production system, and features a user friendly touchscreen interface, presets for various conditions, and intuitive nesting software. It also comes with a range of safety features such as adjustable power supplies and pressure control, which ensure that users can work safely. Finally, the Bonder features extensive service and support options, so users can be sure of continued use after purchase. Overall, MICROTESTER 22 Bonder is a sophisticated and highly versatile instrument that is perfect for a variety of high precision bonding applications. With its advanced features and intuitive interface, it ensures users can quickly and accurately bond components to meet their precise requirements.