Used DAGE Series 4000 PXY #293587177 for sale

DAGE Series 4000 PXY is a state-of-the-art wire and component bonder. It is capable of handling physical sizes of components ranging from 1mm diameter chip-level leads to 8mm diameter copper wire bonds. It is designed to provide high yields and advanced processing capabilities, with repeatable processes that minimize set-up time and minimize downtime. Series 4000 PXY bonder features a high-speed XY-stage, allowing for precision placement of components in three dimensions. It utilizes a range of technologies to achieve reliable, accurate chip placement and wirebonding, including: X-Y-Z stages, thermocouple temperature control, advanced Multi-Mode Process Controls, advanced Vision System and GSM optics package. The X-Y-Z stages have a low profile design, superior repeatability and high accuracy for chip placement and wirebonding. The advanced thermocouple temperature control ensures that the temperature at the bonding area is always within a specified window for optimal wirebond quality. Multi-Mode Process Controls allow for flexible, easy switch over from one type of bonding to another without user intervention. The advanced Vision System allows for simple and reliable chip placement, with built-in features such as automated success/failure recognition, automated simultaneous wirebond parameters, and detector based non-destructive inspection capability to ensure the highest quality of wirebonds. The GSM optics package provides a wide range of magnifications to accommodate wires and chip sizes, as well as variable laser spot sizes. In short, DAGE Series 4000 PXY is a top-of-the-line wire and component bonder that is designed to provide high yields and advanced processing capabilities, while reducing set-up time and downtime. It features a range of technologies and built-in features to ensure the highest quality of wirebonds and chip placement.