Used DAGE Series 4000 PXY #293645966 for sale

DAGE Series 4000 PXY is a fully automated precision die attach and soldering equipment designed for tight die placement and accurate reflow soldering of semiconductor components. The system offers outstanding accuracy, repeatability and thermal process control for a wide range of applications, from power device packaging to wafer level chips-on-boards. The 4000 PXY bonder comes with a 120-station auto indexer, die picker and auto preconditioner, and can accommodate most die sizes up to 0.5mm in height. The unit is built on uniquely designed X/Y positioners that use patented flexure technology to eliminate backlash and reduce angular movement down to 0.005 degrees. The 4000 PXY also utilizes a thermocouple-controlled gold or copper, Pb-Sn ball reflow soldering head for precise, repeatable thermal control. The integrated vision machine verifies the positioning of components, flagging any relevant issues immediately. The tool's integrated die attach software enables users to program, save and recall process recipes tailored specifically to the components being processed. This ensures that all components are handled in the exact same way, allowing parts to be processed with higher yields while minimizing overall process time. The series includes a unique, self-cleaning die picker than quickly removes any debris that collects on the picker head during operations. The 4000 PXY also utilizes a multi-channel control module that manages the entire job and all process parameters. This makes it easy for users to conduct multiple processes without having to reset their parameters for each operation. Finally, the 4000 PXY offers built-in die-temperature monitors and thermocouple controls, allowing users to maintain consistent temperature profiles from job to job. This helps reduce maintenance and defect rates, while providing exceptional repeatability.