Used DAGE Series 4000 PXY #293779186 for sale

DAGE Series 4000 PXY is an innovative bonder designed for a variety of applications in advanced semiconductor packaging. Series 4000 PXY bonder includes a die-attach head, wire-bonding head, contact-bonding head, and vision head. All of these components can work together to provide users with a fully automated bonding solution. The die-attach head utilizes a heated, spring-loaded die paddle to achieve a reliable and repeatable die-attach process. The paddle is ultrasonically cooled to ensure reliable bonding between the die and substrate. The patented design of the die paddle ensures that the orientation and placement of the die is repeatable and accurate. DAGE Series 4000 PXY's wire-bonding head is capable of ultrasonic, thermocompression, and thermosonic bonding. The ultrasonic bonding head includes a high-stability oscillator and an advanced automated wire-feeder mechanism. The wire-feeder is designed to minimize misalignment of the bonding head when changing bond wires. The thermosonic module is also equipped with an advanced settable temperature control equipment for precise temperature control and repeatable bonding conditions. The contact-bonding head is designed with a sophicsted closed-loop force control system that senses the bonding force, adjusts the force to maintain a minimum value, and then retracts the bonding head when the contact has been formed. In addition to that, the contact-bonding head is equipped with a sophisticated linear actuators to ensure precise placement of the contact bond. Finally, Series 4000 PXY's vision head includes an advanced machine vision unit for process monitoring and support. The vision machine is designed to detect and measure component placement on each of the substrates to ensure a uniform bond. In summary, DAGE Series 4000 PXY is an advanced bonder designed for a variety of applications in advanced semiconductor packaging. It includes a die-attach head, wire-bonding head, contact-bonding head, and vision head, providing users with a fully automated bonding solution. Each of the components are designed to provide reliable and repeatable results with high precision.