Used DAGE Series 5000-P #9379139 for sale

DAGE Series 5000-P is an advanced thermoforming bonder designed for high performance bonding applications. With an integrated, modular design, the machine offers excellent repeatability with repeatable temperature accuracy of ± 0.5 °C. The bonder includes a range of process capabilities, including flat die bonding, multi-layer lamination, auto-cutting, and web based graphical user interface. The machine is equipped with pneumatically controlled pushers that can move the heating elements to accurately position the material throughout the bonding process. The bonder is capable of operating in manual, semi-automatic, or fully automatic modes, allowing the user to adjust parameters according to their production needs. The bonder utilizes an advanced direct current (DC) heating system with a closed-loop temperature control system that maintains critical parameters such as bonding temperature and thermal uniformity. This ensures optimal production accuracy during bonding operations. The bonder also features a patented vision system that helps users align and fuse together two different types of materials accurately and quickly. Additionally, it comes with a variety of automatic safety systems, including lockout/tagout procedures that prevent accidental operation of the machine, and safety interlocks to prevent incorrect operation of the machine. The bonder is also designed to be easily integrated into existing production lines. It is equipped with many different connection options, such as USB, Ethernet, and RS485. It also offers built-in automation systems, such as PID (proportional-integral-derivative) control and alarm monitoring, which allow for quick integration into automated production environments. The bonder also features optional data logging to provide detailed performance information, and it has remote diagnostics for quick, easy maintenance. Overall, Series 5000-P is an advanced, highly reliable, and easily integrated bonder. It is designed to meet the highest standards of reliability, repeatability, and accuracy, and it offers an ideal solution for high performance bonding operations.