Used DATACON 8800 FC CHAMEO #9362761 for sale

DATACON 8800 FC CHAMEO is a fully automated mid-level precision die bonder capable of handling a range of low to medium complexity flip chip and die bonding applications. 8800 FC CHAMEO is a highly reliable machine featuring a state of the art design incorporating component library storage, automatic alignment, precision force control and a patented wafer mounting equipment. The machine features a compact, low profile design allowing for the highest precision and flexibility in die placement and bonding. DATACON 8800 FC CHAMEO comes fully equipped with a range of components including a vision system, high resolution camera, two-axis precision motion platform, bonder head and temperature control unit. The machine also utilizes a patented reticle unit which supports the placement accuracy required in a range of bond processes. This machine is based around two infra-red image capture cameras that provide an uninterrupted scan of the die or connector and gives precise location feedback using high resolution images. 8800 FC CHAMEO has a modular design, allowing easy integration into various production flow systems. The machine can be used to automate a wide range of functions from die preparation, die attach and die attach verification. The machine utilizes a highly efficient three zone conditioning platform, allowing for the precise melting of a wide range of die attach materials, such as epoxy, gold, silver and gallium based compounds. The integrated temperature control tool ensures consistent and accurate temperature control and allows for flexible inclusion of new compounds for die attach. DATACON 8800 FC CHAMEO offers reliable data-driven throughput controls and accuracy levels. The machine has the ability to store up to 15 different bond programs consisting of up to 15 individual steps, and this flexibility allows the user to tailor applications to individual customer requirements. In summary, 8800 FC CHAMEO is a highly reliable, precision bonder specifically designed for a range of low to medium complexity applications. The machine features automated alignment, a patented wafer mounting asset and a temperature control unit. It is capable of storing up to 15 bond programs and provides precise location feedback using high resolution images. DATACON 8800 FC CHAMEO is a versatile machine which can be utilized in a wide range of matrix-based flip chip bonding operations.