Used DATACON 8800 FC Quantum #9362758 for sale

DATACON 8800 FC Quantum Bonder is a powerful and precise automatable wire and ribbon bonding platform designed for state-of-the-art production line environments. It features a streamlined, compact footprint for greater production line efficiency, with an ergonomic operator interface for maximum flexibility and control. 8800 FC Quantum Bonder is capable of ultrasonic, thermocompression, and wedge bonders, as well as fine ball and very fine pitch wedge wire bonding, allowing users to handle a wide variety of production needs. Built-in flexibility and advanced design capabilities allow users to create customized tooling to meet specific application requirements. The high speed operation of DATACON 8800 FC Quantum Bonder reduces production cycle time and improves utilization of the bonding line. A secondary loop motor enables higher accuracy wire routing, while an integrated pre-tensioner maintains consistent contact force between the bond and bond pad. An adjustable balancer ensures consistent wire tension for tighter control and more accurate process results. 8800 FC Quantum Bonder features sophisticated vision capabilities, including real-time camera imaging, which allows users to monitor, adjust, and inspect each bond. The automated bond monitor eliminates manual measurement and improves quality control. Additionally, the built-in Advanced Technology Interface (ATI) enables rapid integration of existing systems and processes. The equipment is also designed for fast and efficient maintenance and repair. DATACON 8800 FC Quantum Bonder features tool-free access to all major components, a floating head mechanism for simple wire spooling, and a modular design which simplifies replacement of damaged or worn parts. In addition, the system includes built-in diagnostics and user-friendly software which makes operation and troubleshooting simple and straightforward. Overall, 8800 FC Quantum Bonder is an advanced, efficient production machine which stands as one of the industry's top wire and ribbon bonding platforms. Its precision, flexibility and advanced design capabilities provide a high level of accuracy, dependability, and long-term value.