Used DATACON / BESI 2100FC #9312392 for sale
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ID: 9312392
Vintage: 2014
Die bonders, 4"-12"
Leadframes
CSP Strips
Singulated devices
STH125-FC Strip handler
Flip chip wafer handler, 5"
Wafer handler, 12"
Vision System:
DVI:
Dispense position
FOV: 18 x 18 mm
PVI / EVI:
Pick / Exchange Position
FOV: 9 x 9 mm
BVI:
Bond position
FOV: 9 x 9 mm
Indirect Illumination (IILL): DVI and BVI
Indirect illumination (EVI)
Flip module
Patented Phi-Y pick and place
Accessories:
102325189 Die ejector set A with 90G Chuck
841.270 Needle set R0.1/0.7/8
102223273 Die ejector needle setting tool
1000-6877 Pick-up shank type B
(2) Insert cold QFN standards with vacuum foil set
Options: STH84-FC, SP84, TOS, MHIN, DINP, MHOUT, SMEMIN, SMEMOUT, SMU, SLFLX, PDS, PELD, ION-P, ION-B, PXRAY, DQC
BQC, WMP, HOST, UPS, MIS
Power supply:
208 to 230 VAC, ±10%, 47 Hz to 63 Hz
Maximum standby voltage: 800 VA
Maximum running voltage: 1100 VA (Maximum 2300 VA with hot air blower on)
Compressed air inlet:
500 kPa: 5.0 Bar
850 kPa: 8.5 Bar
PSI: 73 to 123
Average: 20 l/min
Peak: 25 l/min
Vacuum:
Minimum: -75 kPa (-0.75 bar) / min
Average: -11 PSI, 10 l/min
Peak: 20 l/min
Nitrogen (For bond blow):
180 kPa (1.8 Bar)
600 kPa (6 Bar)
PSI: 26 to 87
2014 vintage.
DATACON / BESI 2100FC is a fully automated, all-in-one wire bonder used for a variety of industrial applications. It is capable of high-speed and high-volume operation, making it an ideal choice for mass production. The equipment has a motorized bond head, which allows it to perform complex bonding routines quickly and accurately. It also has a three-axis traverse unit which is used to position components. The bonder also comes with a variety of other features, such as a tooling equipment, a vision system, and an integrated thermal unit. BESI 2100FC has a built-in programmable logic controller (PLC) which is used to control and monitor the machine's operation. This makes it possible to store and recall settings quickly and easily. The software interface is user-friendly, which makes it easy to program new applications as well. The machine can work with a variety of materials, including aluminum, copper, gold, and palladium. It is capable of delivering a wide range of bond sizes, from as small as 0.05mm to as large as 1mm. The bond force and temperature are adjustable, which allows the operator to customize the bonding parameters for each application. DATACON 2100FC has an integrated cleaning machine which helps to ensure a clean operation. It is also equipped with a modular tooling tool, which makes it possible to switch quickly between bond types, speed, pressure, and other parameters. Overall, the machine is designed to provide maximum reliability and repeatability, with minimal setup and downtime.
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