Used DATACON / BESI 2100FC #9328768 for sale

DATACON / BESI 2100FC bonder is a powerful and automated die bonder designed for automated assembly of plastic modules and semiconductor die into packages. It offers high precision die placement and robust performance in a variety of applications, from LED and MEMS device assembly to bonding of fine copper wires and aluminum wirebonds. BESI 2100FC features integrated vision and robotic motion control, allowing automated die placement to +/-25µm accuracy without manual intervention. BESI patented bondhead provides high accuracy and repeatability for both wirebonding and die placement operations. The equipment also offers a wide range of force settings and includes programmable Z height adjustment for addressing stepped die. For efficient production, DATACON 2100FC offers reliable and repeatable die pick and place capability. Advanced software and intuitive software tools ensure easy machine operation and process optimization. The system also features integrated automatic wire tension control, with the capability of setting different tension levels for different wire sizes and bond lengths. Furthermore, a high pressure fluid dispense unit can be provided for enhanced process flexibility. The machine can be configured using various software and hardware options, such as sub-modules, application-specific feeders, and custom tooling. The tool is specially designed for efficient and reliable production in high-volume, mixed-product assembly environments. Its heavy-duty design and open architecture ensures open integration of the asset with existing data collection systems and monitoring devices. Optimally, 2100FC is designed to maximize uptime, minimize costs, maximize yield and provide the most efficient production processes. The flexibility of the model also allows it to adapt easily to different die sizes and wirebonding techniques, providing end users with highly efficient and valuable solutions for a variety of products.