Used DATACON / BESI 8800 Chameo #293616140 for sale

DATACON / BESI 8800 Chameo is a fully automated wire bonder designed for semiconductor and electronic component packaging. It offers a complete solution to the challenges of advanced packaging, including leading processes such as fine pitch and low loop-height bonding. BESI 8800 Chameo also supports high-performance and high-throughput applications. DATACON 8800 Chameo is designed to handle all types of wires (gold, aluminum, and copper), ranging in diameter from 0.006" up to 0.020". It utilizes an advanced integrated vision system that automatically prepares each component for bonding with minimal manual intervention. It features advanced chip bump-alignment technology and extremely accurate top-down control, enabling precision bonding processes at maximum speed. 8800 Chameo also features a patented two-stage process control which enables the fastest possible bond track definition, while preventing breakage and optimizing bond performance. It can bond up to 300 micro-components per hour and is capable of producing up to 1,000 connections per hour. DATACON / BESI 8800 Chameo also features integrated electronics which offer RTM (Real Time Monitoring) and remote servicing. BESI 8800 Chameo is designed for fast and efficient production, with a full range of optional components and modules that support flexible production requirements. It is equipped with a self-cleaning system, ensuring contamination free operation. An extra process shift enables the operator to avoid system downtime. The operator can also remotely control the bonder using a handheld terminal, featuring a digital joystick and predictive control. DATACON 8800 Chameo is an easy to use machine that offers reliable, repeatable performance. The operator interface is intuitive and user-friendly, enabling efficient production flow along with real-time monitoring. With advanced features and a robust design, 8800 Chameo is an ideal solution for municipalities, manufacturers, and OEMs, who require reliability and efficiency in their circuit packaging operations.