Used DATACON / BESI 8800 Chameo #9315350 for sale

Manufacturer
DATACON / BESI
Model
8800 Chameo
ID: 9315350
Wafer Size: 8"- 12"
Vintage: 2009
Die bonder, 8"-12" Option: Fluxer Carrier, 12" Ring frame for wafer Multi chip Up to 6,000 UPH Bonding method: Face down Accuracy: X and Y Axis: ±10µm at 3σ Θ Axis: ±0.10 at 3σ Vision system: Substrate camera: FOV 7.7 x 5.8 mm (10 um / Pixel) Uplook camera: FOV 2.0 x 1.5 mm (2.6 um / Pixel) Non-functional parts: Bond force regulator for left and right gantry CCD Camera and optics for uplooking Hinge / Bracket / Gas cylinder for door assembly Master calibration for chuck table Ionizer and cooling fans Flipper assembly for left and right gantry Monitor Positional controller boards Motor for ES tool and wafer table 2009 vintage.
DATACON / BESI 8800 Chameo is a high-end bonding machine designed to provide high-performance, precision bonding for electronics applications. It is capable of bonding different materials such as copper, gold, aluminium, tin, and polymer films. The machine is highly customizable with options such as wire bonders, lithography and cleaning capabilities which can be tailored to the specific needs of the manufacturer. The machine is equipped with an advanced vision system, advanced pressure control and a fully integrated laser system for high precision production. The highest achievable bonding results for BESI 8800 Chameo are through repeatable and reliable processes which secure the bond even in case of complex substrates. The machine provides perfect precision parameters which ensure robust bonding process. The system is designed to provide precise pressure to the bond joint that directly influences the overall quality of the bond. Additionally, the machine is also capable of performing on-line measurements of the pressure allowing for real-time feedback and correction of any deviations. The machine is equipped with two heads which can accommodate different tools which vary in size, shape, and materials. This helps to adjust the set-up according to the product's requirements. The powerful software integrated into the machine enables easy adjustment of the parameters whilst providing a statistical feedback which can be used to optimize the bond process. Additionally, the machine has an efficient startup program which enables quick and secure device calibration. The machine is fitted with an integrated bonding quality test which checks the bond quality in real-time and is capable of pinpointing potential problems before they occur. DATACON 8800 Chameo is a highly reliable machine which can be tailored to any specific requirements of the manufacturer ensuring consistent bonding results. The availability of this machine in the market ensures the consistent production of electronic products with high precision and reliable performance.
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