Used DATACON / BESI 8800 FC Quantum #293639969 for sale

DATACON / BESI 8800 FC Quantum is a fully automated bump and epoxy bonding equipment that is designed to provide a cost-effective solution for high-speed and high-precision assembly of lead frames, ceramic packages, and other complex substrates. The unit features a 6-axis robotic arm that can be programmed to pick and place components with utmost accuracy and precision at up to 10,000 picks/bonds per hour. BESI 8800 FC Quantum incorporates high-end positioning and orientation sensors to ensure a reliable and consistent bonding experience. It features an incredibly accurate 2-dimensional vision system for ensuring perfect alignment of components to lead frames, substrates, and other material types. DATACON 8800 FC Quantum is capable of performing a variety of precision assembly operations including various types of wire-bonding and thermode soldering processes. The unit is equipped with state-of-the-art control software that enables users to easily adjust parameters, monitor process status and control the unit from a remote location. The monitoring and feedback machine of 8800 FC Quantum enables users to receive detailed reports about progress and status of each task. It has a wide range of interchangeable tooling modules which allows users to perform multiple processes using same equipment. This ensures versatility and flexibility in the operational process. DATACON / BESI 8800 FC Quantum also has a wide range of process control and failure detection options which ensure top-class quality and condition of the finished product. BESI 8800 FC Quantum has a powerful secure network architecture and is capable of real-time remote operation. The unit is also equipped with watchdogs, an event log, secure external device interface and online access with integrated security mechanisms so that users can be sure of the safety of their data and applications. In conclusion, DATACON 8800 FC Quantum is a highly sophisticated high-speed and high-precision automated bump and epoxy bonding tool that is specifically designed for lead frame and ceramic package assembly operations. The unit is equipped with state-of-the-art technology and features a reliable network architecture for remote operation and a range of process control and failure detection options to ensure top quality and condition of the finished product.