Used DATACON / BESI 8800 FC Quantum #293767406 for sale

DATACON / BESI 8800 FC Quantum is a manual bonder designed to create and attach microelectronic components using technology including spot welding and thermal compression bonding. This versatile machine is suitable for use with a wide variety of interconnected electrical and mechanical components for semiconductor applications such as microelectromechanical devices, optoelectronics, and imaging sensors. The bonder features a dry-clamp container that can hold up to 800 dies, allowing it to simultaneously process multiple microelectronic components with ease. BESI 8800 FC Quantum utilizes bond force and temperature ideal for both gold and aluminum wire materials. Additionally, the machine can be easily set to a variety of bond forces (5-45 g), heated temperatures (35-350°C) and cooling rates (0-60°C in 2 s) to maintain a consistent bond quality and minimize potential for irregular connections while protecting delicate electronic components. DATACON 8800 FC Quantum is equipped with a robust computer system featuring an ultra-precise force curve control, thermal profile control, and an extensive software interface that allow for maximum operation of the machine. The software interface includes the ability to detect and adjust process parameters in real time, avoiding potential errors. Additionally, the system's intelligent terminal features a 7" graphical touch panel that allows users to adjust the operational parameters without having to re-program them each time they need to perform a bonding task. The bonder is constructed with a C-type frame and its stress-relief geometry helps ensure optimum bond stability during operation. The 7-axis process frame provides maximum flexibility for the bonder, allowing for smooth application of forces turned in many directions. The versatile 8800 FC Quantum is also equipped with exchangeable sample stages to accommodate job-specific needs. DATACON / BESI 8800 FC Quantum helps streamline the assembly of electronic components by eliminating the need to manually bond delicate components. The intuitive design, reliable force curve control, and precise thermal profile control help make the machine efficient and user-friendly. The extensive software interface makes BESI 8800 FC Quantum an ideal for creating and attaching high-quality microelectronic components.