Used DATACON / BESI 8800 FC Quantum #293817200 for sale

The DATCONDATACON / BESI 8800 FC Quantum bonder is a highly advanced electronic interconnect device designed for use in semiconductor and circuit board assembly and repair. This machine combines the convenience of an 8″ tilt-back frame with a variety of automated features to provide rapid, accurate, and reliable bonding operations in a variety of commercial and industrial situations. BESI 8800 FC Quantum is capable of performing wire bonding, thermosonic aluminum and gold bond, gold to gold and aluminum alloy wedge bonding processes. The powerful 64-bit processor and supporting software suite allows the operator to quickly create programs with advanced features such as 3-D internal vision alignment, perimeter vision alignment at high speed, and automatic recognition of the wire type, diameter, and color. It provides up to 28 user-selectable steps per program, allowing for up to 250 user-programmable bonding recipes. The machine is fitted with a 28 zone, 8″ tilt-back frame for easy access to the device and is equipped with an integrated 10″ LCD touchscreen to enable rapid set up and monitoring of complex operations. DATACON 8800 FC Quantum also features several types of precision bonding heads, allowing it to be used for a variety of applications including chip on board, soldering and fluxless soldering, flip-chip bonding, and ribbon bonding. The DATCON8800 FC Quantum is highly reliable, designed to operate at temperatures ranging from -40°C to +125°C, and has a long-term warranty provided by the manufacturer. This machine is the perfect choice for high-end electronic operations due to its advanced features and performance capabilities. DATACON / BESI 8800 FC Quantum also offers its operators a range of software tools to simplify used in various technological processes, from routine repairs to complex assembly operations.