Used DATACON / BESI 8800 FC Quantum #9052286 for sale

The DATCONDATACON / BESI 8800 FC Quantum is a high-precision, fully automated, thermosonic ball bonding machine designed for the most efficient manufacturing of microelectronic bonding applications. This bonder is equipped with a high-end vision equipment, a closed-loop servo system, a 9-axis servo robot, and an advanced control unit to enable accurate programmable bonding processes that meet the highest production requirements. The DATCONBESI 8800 FC Quantum has a 4-Axis motion machine that provides smooth, precise, and continuous motion. It has a high-speed servo robot and vision tool that accurately aligns and positions the bonder to the substrate. The servo robot provides fully automated process control and the sub-micron resolution of the motion asset ensures an excellent yield and high-quality bonds. The machine has a 5-point contactless chuck model for fast and precise handling of wire bonding components, a fully automated bond force feedback loop which maintains consistent bond forces even after long-term use, and a data acquisition equipment which allow for monitoring and analysis of process-related data in real-time. The DATCONDATACON 8800 FC Quantum also has additional features such as a high-powered laser marker, programmable quartz annealers, and a wide variety of bond head choices. The DATCON8800 FC Quantum is a powerful and efficient tool for production and prototyping. Its features provide maximum control and accuracy to ensure the best bond performance. This thermosonic ball bonder is capable of bonding wires, abrasives, seals, clips, carbon spray, and various plastic films for a wide variety of microelectronic component bonding applications. DATACON / BESI 8800 FC Quantum is also equipped with a powerful display for easy monitoring of production processes and diagnostics. Its flexibility and high accuracy make it a valuable addition to any production facility.