Used DATACON / BESI 8800 FC Quantum #9245219 for sale

DATACON / BESI 8800 FC Quantum Bonding Equipment is the latest model in the range of an automated die bonding systems designed and manufactured by BESI Technology AG. This system is capable of performing high quality, repeatable die attach assembly capability - ranging from plastic packages, singulated die and die arrays to delicate components such as flip chips. This automated unit is mainly used for die bonding in the sectors of MEMS, semiconductors, optoelectronics and other micro electronic applications. BESI 8800 FC Quantum Bonding machine is equipped with a capability for on-the-fly (OTF) alignment which vastly reduces cycle times for the entire die attach process. This tool's fast, high precision OTF alignment method coupled with high accuracy die up and die down ensures a successful production. This asset is further loaded with automated reflow capabilities providing an ideal solution for numerous die attach assembly operations. DATACON 8800 FC Quantum Bonder also incorporates components which facilitate easy maintenance. This includes "plug & play" tooling to reduce the time required for any tooling change required. Additional features such as the programmable and operator selectable stroke height, and automated frame and nozzle alignment provide further advantages in ease of maintenance and operation. The model is also provided with an intuitive user interface. The GUI offers a fully customized control over various parameters, thereby giving operators the capability to leverage the precise repeatability of the equipment to its fullest potential. The robust and reliable industrial design of 8800 FC Quantum Bonder also increases the reliability of the machine for achieving flawless die attach processing. To sum up, DATACON / BESI 8800 FC Quantum Bonder from DATACON Technology is an ideal choice for die attach processes such as plastic packages, singulated die and die arrays as well as delicate components like flip chips. This automated system offers various features such as OTF alignment, high accuracy die up and down, automated reflow, "plug & play" tooling, programmable and operator selectable stroke heights, automated frame and nozzle alignment and an intuitive user interface. All these features make BESI 8800 FC Quantum Bonder the ideal unit for any die attach assembly process.