Used DATACON / BESI 8800 FC #293615251 for sale

DATACON / BESI 8800 FC Bonder is a highly integrated, computer-controlled wire bonder specifically designed for high volume production of the latest wire-bonding technologies. It is easy to program, offers a wide range of options and is renowned for its versatility, usability and efficiency. The innovative design makes it perfectly suited for cost sensitive wire bonding applications. The bonder is equipped with a state-of-the-art Servo axis drive equipment, which ensures fine motion control of its welding head and wire alignment. This drive system allows for precise movements and repeatable accuracy, giving the user great flexibility in managing their production runs. In addition, the unit is equipped with an advanced auto-learning mode, allowing operators to quickly set up and optimize their wire bonding processes. BESI 8800 FC is outfitted with a powerful bonding controller that offers ultra-precision control for all types of wire bonder processes. It features a user-friendly touchscreen interface, flawless data input and detailed production data recording. The bonder also has a full-color CCD vision machine, capable of monitoring the process and providing accurate wire alignment capabilities. When it comes to durability, DATACON 8800 FC is built for reliability. It features a superior automatic dual-layer splicing tool, designed for high-speed production and long-lasting precision. The bonder utilizes an advanced multi-zone glass-filled nylon housing, making it resistant to shock, vibration and temperature changes. Also, the machine's superior build quality and high-end components give it an excellent MTBF rating. 8800 FC comes with all the necessary components and parts needed to successfully produce wire bonds. The kit includes a work stage and bonder components, as well as an integrated asset power supply and a manual. Overall, DATACON / BESI 8800 FC is a top of the line wire bonder, tailor-made for high-volume production applications. Its superior construction and high-tech features allow for precise wire bonding processes, making it an ideal choice for circuit prototypes and semiconductor manufacturing. With its unparalleled performance and robust design, BESI 8800 FC can easily handle the most demanding industrial requirements.