Used DATACON / BESI 8800 #293637324 for sale

DATACON / BESI 8800 is an advanced multi-purpose bonder specifically designed for high speed and high accuracy die assembly in electronics and IC packaging applications. It is capable of producing wirebonding and die bonding at rates up to 4,000 bond points per hour, with controlled speed and accuracy. BESI 8800's flexible design allows for a wide range of bond configurations, making the equipment ideal for various electronic assembly applications, such as consumer electronics and integrated circuit (IC) packages. The system comes with a standard modular tooling unit that includes gold, aluminium and copper wire, epoxy, and fluxer functions, as well as capability for copper, copper-clad and copper/nickel thermal compression mode (TCM) applications. DATACON 8800 features a software-controlled, high-resolution video machine that makes real-time adjustments to the bond head motion, ensuring accurate bond placement in terms of repeatable speed, accuracy and force. This improves variations in wire characteristics, ensuring consistent bonds and eliminating post-reflow deformation. 8800 includes enhanced thermal and mechanical sensors for temperature/pressure control, ensuring that temperatures and pressures do not exceed acceptable levels. The tool has a vacuum-based die attach asset and a magnetic field-based wire aligner, guaranteeing accurate bond placement and improved wire-to-die adhesion. Its auto programming and data entry model simplifies operations, while led lights and a laser positioning equipment ensures accuracy. DATACON / BESI 8800 is designed to operate in conjunction with off-line test and burn-in facilities, providing fast, accurate and reliable bonds in commercial, automotive and industrial applications. Its user-friendly touchscreen interface allows for easy operation and programming, as well as automatic fault diagnostics and alarm triggers. In summary, BESI 8800 is a multi-purpose bonder designed to tackle advanced assembly applications and deliver high-speed, high-accuracy operations at optimized costs. It is an ideal solution for consumer electronics and IC packages requiring accurate placement and repeatable speed, accuracy and force.