Used DATACON / BESI 8800 #293759002 for sale

DATACON / BESI 8800 is a high-precision bonder designed for automated production of integrated circuits. It is a semi-automatic system consisting of a base and a component vacuum chuck. The component vacuum chuck holds the substrate wafers during the bonding process. The robotic arm is used to precisely pick and place the components onto the substrate. It is designed with a long work envelope to ensure access to all areas of the substrate. The tool is also capable of very precise manual positioning of the attachments during the bonding process, thanks to its highly flexible control capabilities. BESI 8800 offers four different types of bonding: pressure sensitive adhesive (PSA), thermocompression bonding, thermopressure bonding, and die attach. It includes an active wafer clamping feature, which facilitates load reuse and minimizes the cost of ownership. DATACON 8800 features a dual stage pre-heat oven, which ensures reliable and consistent bonding results. The oven is heated up to 500°C and the heated substrate enters the active connection area. The active connection area then performs the bonding process, by precisely controlling the temperature, pressure, and time of the bonding operation. 8800 includes a fully integrated vision system, which ensures the proper alignment and assembly of components. The vision system also guides the robot in placing the components during the bonding process. The robot is equipped with automatic speed control, which maintains a constant speed for the entire bonding cycle. DATACON / BESI 8800 is equipped with a high precision positioning capability, which enables automated production of very fine pitch contact pads, contacts, and other features on the substrate. It can be used for either through-hole or surface mount applications. BESI 8800 is an ideal choice for high end applications such as flip chip, BGA chip-on-board, and other advanced packaging techniques. It is well suited for applications requiring high accuracy levels and is capable of producing very fine bond lines.